Semiconductor device and fabrication method thereof

ABSTRACT

A semiconductor device and a fabrication method thereof in which the semiconductor device includes capacitors having a metal/insulator/metal (MIM) structure are disclosed. The method includes forming an interlayer insulating film on a structure of a semiconductor substrate that exposes lower wiring and a lower insulating film; selectively etching the interlayer insulating film to form a first electrode opening that exposes the lower wiring; forming a first electrode in the first electrode opening such that the first electrode opening is filled; selectively etching the interlayer insulating film at a region of the same adjacent to the first electrode to thereby form a second electrode opening; forming a dielectric layer along inner walls that define the second electrode opening; forming a second electrode on the dielectric layer in such a manner to fill the second electrode opening; and forming upper wiring on at least a portion of the second electrode.

This is a Division of U.S. patent application Ser. No. 10/630,179 filedon Jul. 30, 2003, now U.S. Pat. No. 6,794,702.

FIELD OF THE DISCLOSURE

The present disclosure relates to a semiconductor device and afabrication method thereof, and more particularly, to a semiconductordevice and a fabrication method thereof in which the semiconductordevice includes capacitors having a metal/insulator/metal (MIM)structure.

BACKGROUND

In recent times, much research is being pursued in the area ofsemiconductor devices in order to realize high-capacity capacitors inanalog circuits that require high-speed operation. Since conductivepolysilicon is used for an upper electrode and a lower electrode in thecase of a PIP structure, that is, a structure in which polysilicon, aninsulator, and polysilicon are layered, an oxidation reaction occursbetween contacting surfaces of a dielectric film and the upper and lowerelectrodes to form a natural oxidation film. The natural oxidation filmreduces overall capacitance.

To remedy this problem, an MIS (metal/insulator/silicon) structure or anMIM (metal/insulator/metal) structure is used for the capacitor. Thelatter (i.e., the capacitor having the MIM structure) is more commonlyused in semiconductor devices as a result of its low resistivity, andbecause such a capacitor has no internal parasitic capacitance, which iscaused by depletion.

A method of fabricating a capacitor having the MIM structure accordingto a conventional semiconductor device manufacturing method is describedherein with reference to the drawings. FIGS. 1A, 1B, and 1C, which arepartial sectional views used to describe the formation of a capacitorhaving an MIM structure using a conventional method.

Referring first to FIG. 1A, a lower insulating film 2 is formed on asemiconductor substrate 1. The lower insulating film 2 is realized usingconventional semiconductor device processes and formed of an oxidationfilm such as PSG (phospho-silicate glass). Next, a Ti barrier layer 3,Al lower wiring 4, a Ti glue layer 5, and a TiN reflection preventingfilm 6 are formed in this sequence on the lower insulating film 2. Also,an SiN dielectric layer 7, which acts as a capacitor, is formed on theTiN reflection preventing film 6.

Subsequently, a first photosensitive film pattern is formed on the SiNdielectric layer 7. The first photosensitive film pattern is used as amask to selectively etch the SiN dielectric layer 7 to thereby form theSiN dielectric layer 7 to a predetermined width, after which the firstphotosensitive film pattern is removed and a cleaning process performed.An area of the SiN dielectric layer 7 is varied according to the desiredcapacitance value, and is typically approximately 10 by 10.

Next, a second photosensitive film pattern, which has a greater widththan the first photosensitive film pattern, is formed on the SiNdielectric layer 7 and the TiN reflection preventing film 6. The secondphotosensitive film pattern is used as a mask such that an exposed areaof the TiN reflection preventing film 6, and predetermined areas of theTi glue layer 5, the Al lower wiring 4, and the Ti barrier layer 3 underthis exposed area of the TiN reflection preventing film 6 are etched.This results in the TiN reflection preventing film 6, the Ti glue layer5, the Al lower wiring 4, and the Ti barrier layer 3 being leftremaining at a predetermined width. The second photosensitive pattern isthen removed and a cleaning process is performed.

Subsequently, with reference to FIG. 1B, an HDP (high density plasma)oxidation film 8 is formed using an HDP process to fill gaps betweenadjacent metal wiring, after which a TEOS film 9 is formed on the HDPoxidation film 8 using conventional plasma processes. A CMP (chemicalmechanical polishing) process is then performed to flatten an uppersurface of the TEOS film 9.

Next, a photosensitive film is deposited on the flattened upper surfaceof the TEOS film 9, then exposure and development are performed to forma third photosensitive film pattern that exposes predetermined areas ofthe upper surface of the TEOS film 9 (i.e., areas where via openingswill be formed). The third photosensitive film pattern is then used as amask to perform reactive ion etching of exposed portions of the TEOSfilm 9 and the HDP oxidation film 8 thereunder, thereby forming viaopenings 100 of a predetermined width that expose an upper surface ofthe SiN dielectric layer 7.

Next, with reference to FIG. 1C, following the removal of the thirdphotosensitive film pattern and the performing of a cleaning process, afirst barrier metal film 10 is formed along inner walls of the viaopening 100. Tungsten 11 is then formed covering the first barrier metalfilm 10 and completely filling the via opening 100. Following thisprocess, CMP is performed until the upper surface of the TEOS film 9 isexposed.

Subsequently, a Ti barrier film 12, Al upper wiring 13, a Ti glue layer14, and a TiN reflection preventing film 15 are formed in this sequenceon the flattened upper surface of the TEOS film 9 and the tungsten 11.

In the conventional method described above, aluminum is used as thewiring metal material to form the lower electrode, dielectric layer, andupper electrode of the capacitor on the lower wiring, then upper wiringis formed over these elements. The conventional capacitor therefore hasa vertical structure.

However, the capacitance of the capacitor is dependent upon the contactarea of the dielectric layer and the upper and lower electrodes or thethicknesses of these elements, and the areas of the upper substrate andthe lower substrate must be at least as large as the contact area of thedielectric layer. Accordingly, in the case where the upper wiring, whichis significantly more densely formed than the lower wiring, thiscondition acts to restrict the degree of integration that can beobtained.

Further, with the capacitor having such a vertical structure, becausethe dielectric layer is formed perpendicular to the etching direction,that is, to the direction of etching the via openings, a thickness ofthe dielectric layer may be altered in the process of etching. This mayresult in an abnormal capacitance value and ultimately cause the deviceto malfunction.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A, 1B, and 1C are partial sectional views depicting the formationof a capacitor using a conventional method.

FIGS. 2A through 2H are partial sectional views depicting an examplemethod for fabricating a semiconductor device.

FIGS. 3A through 3H are plan views of structures shown in FIGS. 2Athrough 2H, respectively.

DETAILED DESCRIPTION

Tungsten (W), aluminum (Al), and aluminum alloys are metals widely usedfor metal wiring in a semiconductor device. Many are actively pursuingresearch into using copper (Cu) in place these other metals for themetal wiring of semiconductor devices since copper has a low resistivityand is more reliable than tungsten and aluminum.

However, unlike with tungsten and aluminum, it is difficult to formwiring by reactive ion etching using copper. Accordingly, when usingcopper, copper is blanket-formed on a wafer having formed thereon viaopenings, then excess copper on a surface of the wafer is removedthrough chemical mechanical polishing (CMP) to thereby form copperwiring using a damascene process.

In the examples described herein, such a damascene process is used toform wiring material and electrode material, and to form capacitors in ahorizontal structure.

FIGS. 2A through 2H are partial sectional views depicting a method forfabricating a semiconductor, and FIGS. 3A through 3H are plan viewsshowing structures shown in FIGS. 2A through 2H, respectively. A crosssection and upper view of a completed semiconductor device fabricatedaccording to the a preferred example are shown in FIGS. 2H and 3H,respectively.

With reference to the drawings, lower wiring 23 and a lower insulatingfilm 22 are formed exposed on a structure 21 of a semiconductorsubstrate on which individual devices are formed. An interlayerinsulating film 24 is formed on the lower insulating film 22. Theinterlayer insulating film 24 includes a first electrode opening 201, avia opening 202, and a second electrode opening 203 that expose thelower wiring 23.

A first electrode 25 fills the first electrode opening 201, dielectriclayers 28 and 29 are formed over inner walls that define the secondelectrode opening 203, and a second electrode 30 is formed over the,dielectric layers 28 and 29 filling the second electrode opening 203.The first electrode 25 and the second electrode 30 are preferably madeof copper. Further, the first electrode opening 201 and the secondelectrode opening 203 are structures that include a plurality ofbranches that extend away from a base portion. As a result, the firstelectrode 25 corresponds to the shape of the first electrode opening201, and the second electrode 30 and the dielectric layers 28 and 29correspond to the shape of the second electrode opening 30.

Various materials may be used for the dielectric layers 28 and 29depending on the desired device characteristics. For example, siliconoxide may be used for the dielectric layer 28, and silicon nitride maybe used for the dielectric layer 29, with the silicon oxide and thesilicon nitride being formed in this sequence to result in a layeredconfiguration of the dielectric layers 28 and 29.

Upper wiring 32 is formed covering at least a portion of the secondelectrode 30, and an upper insulating film 31 is formed on theinterlayer insulating film 24 and over all other elements such that anupper surface of the upper wiring 32 is left exposed. The upper wiring32 and the lower wiring 23 may be made of copper.

A method of fabricating the semiconductor device described above willnow be described in detail.

Referring first to FIGS. 2A and 3A, the structure 21 of a semiconductorsubstrate that includes individual devices formed using conventionalsemiconductor device processes is formed on the semiconductor substrate.Next, the lower insulating film 22 is formed on the semiconductorsubstrate structure 21, the lower insulating film 22 is selectivelyetched to form wiring openings 200, then copper is plated or sputteredall exposed elements. Chemical mechanical polishing is then performeduntil the lower insulating film 22 is exposed. The lower wiring 23 isformed by the copper that fills the wiring openings 200.

The lower wiring 23 need not necessarily be formed using copper, and itis possible to realize the lower wiring 23 using another metal. That is,a film made of a metal such as tungsten may be formed and patterned torealize the lower wiring 23 for the formation of a circuit of asemiconductor device.

Subsequently, the interlayer insulating film 24 is formed over theentire surface of the lower insulating film 22 and the lower wiring 23.The interlayer insulating film 24 is formed using a conventional plasmaprocess and at a thickness of approximately 5000 Å.

Next, with reference to FIGS. 2B and 3B, the interlayer insulating film24 is selectively etched to simultaneously form the first electrodeopening 201 of the capacitor and the via opening 202. The firstelectrode opening 201 and the via opening 202 expose the lower wiring23. The first electrode opening 201 of the capacitor may be formed tovarious shapes that make its surface area as large as possible. As anexample, the first electrode opening 201 is formed as a structure thatincludes a plurality of branches that extend away from a base portion asshown in FIG. 3B.

Following the above processes, with reference to FIGS. 2C and 3C, copperis coated over all elements such that the first electrode opening 201and the via opening 202 are filled to thereby form the first electrode25 and a via 26. Chemical mechanical polishing is then performed untilthe interlayer insulating film 24 is exposed.

Next, with reference to FIGS. 2D and 3D, a photosensitive film isdeposited, then exposed and developed to thereby form a photosensitivefilm pattern 27. The photosensitive film pattern 27 is formed such thatit has an opening corresponding to the location of the first electrode25. The opening of the photosensitive film pattern 27 is larger than thefirst electrode 25 such that the same is fully exposed, as is an area ofthe interlayer insulating film 24 adjacent to the first electrode 25where the second electrode 30 (see FIGS. 2G and 3G) will be formed. Thesecond electrode 30 of the capacitor is formed on the same layer as thefirst electrode 25 to be connected to the same in a horizontalconfiguration. The second electrode 30 is formed similarly to the firstelectrode 25 (i.e., similarly to the first electrode opening 201 intowhich the first electrode 25 is formed) having a plurality of branchesthat extend away from a base portion. The branches of the secondelectrode 30 are extended between the branches of the first electrode25.

Next, with reference to FIGS. 2E and 3E, the photosensitive film pattern27 is used as a mask to selectively etch the interlayer insulating film24, thereby forming the second electrode opening 203 of the capacitor.The photosensitive film pattern 27 is then removed and a cleaningprocess is performed. During etching to form the second electrodeopening 203, the etching select ratio of the interlayer insulating film24 to the copper forming the first electrode 25 approaches infinity suchthat the first electrode 25 undergoes almost no change.

Referring now to FIGS. 2F and 3F, the dielectric layers 28 and 29 arethinly formed over all elements exposed following the processesdescribed with reference to FIGS. 2E and 3E. Various materials may beused for the dielectric layers 28 and 29 depending on the desired devicecharacteristics. In the example shown, silicon oxide is used for thedielectric layer 28, and silicon nitride is used for the dielectriclayer 29, with the silicon oxide and the silicon nitride being formed inthis sequence to result in a layered configuration of the dielectriclayers 28 and 29. Preferably, each of the dielectric layers 28 and 29 isformed to a thickness of approximately 300 Å.

Subsequently, with reference to FIGS. 2G and 3G, copper is coated overall exposed elements such that the second electrode opening 203 isfilled to thereby form the second electrode 30. Chemical mechanicalpolishing is then performed until the interlayer insulating film 24 isexposed. Since the dielectric layers 28 and 29 are formed along allinner wall surfaces of the second electrode opening 203, the contactarea between the dielectric layers 28 and 29, and the first and secondelectrodes 25 and 30 is substantial (i.e., significantly increased overthe prior art). The contact area may be further increased by adding morebranches to the first and second electrode openings 201 and 203.

With the formation of the first and second openings 201 and 203 on thesame layer, and the dielectric layers 28 and 29 formed along the innerwalls of the second opening 203 again on the same layer, the capacitoris referred to as having a horizontal structure.

Finally, referring to FIGS. 2H and 3H, the upper insulating film 31 isformed over all exposed elements, after which the upper insulating film31 is selectively etched to form a wiring opening connecting the secondelectrode 30 and the via 26. Copper is then coated over all elementssuch that the wiring hole is filled, and chemical mechanical polishingis performed until the upper insulating film 31 is exposed to therebyform the upper wiring 32. As with the lower wiring 23, the upper wiring32 need not necessarily be formed using copper, and it is possible torealize the upper wiring 32 using another metal. That is, a film made ofa metal such as tungsten may be formed and patterned to realize theupper wiring 32 for the formation of a circuit of a semiconductordevice.

In the examples described above, the capacitor is formed in a horizontalconfiguration, the first and second electrodes are formed having, aplurality of extending branches, and the dielectric layers are formedalong the inner wall surfaces of the second electrode opening. As aresult, the width of the upper wiring may be reduced over theconventional horizontal structure, thereby allowing an increase in thedegree of integration of the upper wiring.

Further, in the example capacitor having the horizontal structure,because the first and second electrodes are formed with a plurality ofextending branches as described above, the contact area between thedielectric layers and the first and second electrodes may besignificantly increased compared to when using conventionalconfigurations. This also allows a reduction in the width of thecapacitor for the same contact area such that the degree of integrationof the wiring may be increased.

In addition, with the formation of the dielectric layers over innerwalls of the second electrode opening, the dielectric layers are safelyleft intact when etching the interlayer insulating film to form the viaopening. This ensures that the thicknesses of the dielectric layersundergo almost no change, thereby stably maintaining the desiredcapacitance value and ultimately preventing malfunctioning of thedevice.

As set forth in the foregoing examples, a semiconductor device and afabrication method thereof prevents malfunctioning of the device as aresult of the problems encountered when utilizing capacitors having avertical structure, namely, malfunctioning caused by limitations in thedegree of integration of wiring and by variations in a thickness of adielectric layer.

In addition, a first electrode, a dielectric layer, and a secondelectrode are formed on the same layer in a horizontal configuration.Further, the first and second electrodes are formed in a shape thatincreases their surface area. As an example, the first and secondelectrodes are each formed as structures including a plurality ofbranches that extend from a base portion, and the dielectric layer isformed along surfaces of the branches where the first and secondelectrodes make contact.

The example method for fabricating a semiconductor device includesforming an interlayer insulating film on a structure of a semiconductorsubstrate that exposes lower wiring and a lower insulating film;selectively etching the interlayer insulating film to form a firstelectrode opening that exposes the lower wiring; forming a firstelectrode in the first electrode opening such that the first electrodeopening is filled; selectively etching the interlayer insulating film ata region of the same adjacent to the first electrode to thereby form asecond electrode opening; forming a dielectric layer along inner wallsthat define the second electrode opening; forming a second electrode onthe dielectric layer in such a manner to fill the second electrodeopening; forming upper wiring on at least a portion of the secondelectrode.

Preferably, following the filling of the first electrode opening and thesecond electrode opening with the material used for the first and secondelectrodes, the first and second electrodes are formed by performingchemical mechanical polishing of a material used for the first andsecond electrodes until the interlayer insulating film is exposed. Also,it is preferable that the first and second electrodes are each formed ina structure having a plurality of branches extending from a baseportion.

In addition, the dielectric layer is formed preferably by layeringsilicon oxide and silicon nitride.

Although example embodiments have been described in detail, it should beclearly understood that this patent covers all methods, apparatus andarticles of manufacture fairly falling within the scope of the appendedclaims either literally or under the doctrine of equivalents.

1. A method for fabricating a semiconductor device, comprising: formingan interlayer insulating film on a semiconductor substrate that exposeslower wiring and a lower insulating film; selectively etching theinterlayer insulating film to form a first electrode opening thatexposes the lower wiring; forming a first electrode in the firstelectrode opening so that the first electrode opening is filled;selectively etching the interlayer insulating film at a region adjacentto the first electrode to form a second electrode opening; forming adielectric layer along inner walls that define the second electrodeopening; forming a second electrode on the dielectric layer to fill thesecond electrode opening; and forming upper wiring on at least a portionof the second electrode.
 2. The method of claim 1, wherein, followingthe filling of the first electrode opening with the first electrode, thefirst electrode is formed by performing chemical mechanical polishing ofa material used for the first electrode until the interlayer insulatingfilm is exposed.
 3. The method of claim 1, wherein following the fillingof the second electrode opening with the second electrode, the secondelectrode is formed by performing chemical mechanical polishing of amaterial used for the second electrode until the interlayer insulatingfilm and the first electrode are exposed.
 4. The method of claim 3,wherein the dielectric layer on the first electrode and the interlayerinsulating film is removed when performing chemical mechanical polishingto form the second electrode.
 5. The method of claim 1, wherein theupper wiring is formed by forming an upper insulating film over thefirst electrode, the dielectric layer, the second electrode, and theinterlayer insulating film, selectively etching the upper insulatingfilm to form a wiring opening that exposes a least a portion of thesecond electrode, and filling the wiring opening with a metal material.6. The method of claim 1, wherein the dielectric layer is formed bylayering silicon oxide and silicon nitride.
 7. The method of claim 1,wherein the first electrode and the second electrode are each formed tohave a plurality of branches that extend from a base portion.
 8. Amethod for fabricating a semiconductor device, comprising: forming aninterlayer insulating film having a first trench (a first electrodeopening) on a substrate; forming a first electrode of a capacitor withinthe first trench; forming a second trench (a second electrode opening)in the interlayer insulating film adjacent to the first electrode toexpose a side of the first electrode; forming a dielectric layer alonginner walls of the second trench; and forming a second electrode of thecapacitor on the dielectric layer to fill the second trench, includingthe steps of (i) forming a second metal layer on the interlayerinsulating film to fill the second trench, and (ii) performing chemicalmechanical polishing of the second metal layer until a surface of theinterlayer insulating film is exposed.
 9. The method of claim 8, whereineach of the first and second electrodes has a top view in shape of acomb having a plurality of recess and concave patterns.
 10. The methodof claim 9, wherein the recess patterns of the first electrode areformed face to face with the concave patterns of the second electrode,and the concave patterns of the first electrode are formed face to facewith the recess patterns of the second electrode.
 11. The method ofclaim 8, wherein the first and second electrodes have walls facing eachother, each wall having the plurality of recess and concave patterns.12. The method of claim 11, wherein the recess patterns of the firstelectrode are formed face to face with the concave patterns of thesecond electrode, and the concave patterns of the first electrode areformed face to face with the recess patterns of the second electrode.13. The method of claim 8, wherein the dielectric layer is formed in amulti-layered structure having at least two layers.
 14. The method ofclaim 8, wherein the dielectric layer includes a silicon oxide layer anda nitride layer.
 15. The meted of claim 8, wherein the first and secondelectrodes are formed on the same layer.
 16. The method of claim 8,wherein the first and second electrodes are made of copper.
 17. Themethod of claim 8, wherein the step of forming the first electrodeincludes forming a first metal layer on the interlayer insulating filmto fill the first trench; and performing chemical mechanical polishingof the first metal layer until a surface of the interlayer insulatingfilm is exposed.
 18. A method for lubricating a semiconductor device,comprising: forming a lower insulating layer having a wire opening on asubstrate; forming a lower wire within the wire opening; forming aninterlayer insulating film on the substrate including the lowerinsulating layer and the lower wire; forming a first electrode openingin the interlayer insulating film to expose the lower wire; forming afirst electrode of a capacitor within the first electrode opening tocontact the lower wire; forming a second electrode opening in theinterlayer insulating film adjacent to the first electrode to expose aside of the first electrode; forming a dielectric layer along innerwalls of the second electrode opening; forming a second electrode of thecapacitor within the second electrode opening; and forming an upper wireelectrically connected with the second electrode.
 19. The method ofclaim 18, wherein each of the first and second electrodes has a top viewin shape of a comb having a plurality of recess and concave patterns.20. The method of claim 19, wherein the recess patterns of the firstelectrode are formed face to face with the concave patterns of thesecond electrode, and the concave patterns of the first electrode arefanned face to face with the recess patterns of the second electrode.21. The method of claim 18, wherein the first and second electrodes havewalls facing each other, each wall having the plurality of recess andconcave patterns.
 22. The method of claim 21, wherein the recesspatterns of the first electrode are formed face to face with the concavepatterns of the second electrode, and the concave patterns of the firstelectrode are formed face to face with the recess patterns of the secondelectrode.
 23. The method of claim 18, wherein the dielectric layer isformed in a multi-layered structure having at least two layers.
 24. Themethod of claim 18, wherein the dielectric layer includes a siliconoxide layer and a nitride layer.
 25. The method of claim 18, wherein thedielectric layer is formed at both sides and a lower surface of thesecond electrode.
 26. The method of claim 18, wherein the firstelectrode is formed on the lower wire.
 27. The method of claim 18,wherein the first electrode is formed on the lower wire and the lowerinsulating layer adjacent to the lower wire.
 28. The method of claim 18,wherein the second electrode is formed on the lower insulating layer.29. The method of claim 18, wherein the second electrode is formed onthe lower wire and the lower insulating layer.
 30. The method of claim18, wherein the first and second electrodes are formed on the samelayer.
 31. The method of claim 18, wherein the first and secondelectrodes are made of copper.
 32. The method of claim 18, wherein thestep of forming the lower wire includes forming a metal layer on thelower insulating layer to fill the lower wire opening; and performingchemical mechanical polishing of the metal layer until a surface of thelower insulating layer is exposed.
 33. The method of claim 18, whereinthe step of forming the first electrode includes forming a metal layeron the interlayer insulating film to fill the first electrode opening;and performing chemical mechanical polishing of the metal layer until asurface of the interlayer insulating film is exposed.
 34. The method ofclaim 18, wherein the step of forming the second electrode includesforming a metal layer on the interlayer insulating film to fill thesecond electrode opening; and performing chemical mechanical polishingof the metal layer until a surface of the interlayer insulating film isexposed.